Vacuum-Reflow ovens
Pore-free soldering is a basic requirement in high-performance electronics. Life support devices, the control technology in aircraft and the driving assistance system in the automobile sector all have one thing in common: they must function absolutely safely and error-free for many years. One condition for this is an almost pore-free solder connection. Pores in a solder joint must be reduced to a permissible minimum.
| Category | Vacuum-Reflow ovens |
|---|---|
| Our solution | Inspection and production in SMT |
| Supplier | SMT Thermal Discoveries |
Main features and benefits of the device
- Pores are reduced by up to 99%
- Suitable for printed circuit boards, DCBs, lead frames and workpiece carriers
- Powerful vacuum pump (300 m³/h) fast and reliable vacuum process
- Profiles can be set with and without vacuum
- Parameters can be set individually: evacuation time, vacuum holding time, ventilation time, vacuum pressure
- Stainless steel vacuum chamber
System models
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