CA20
Compact and versatile solution from 2D and 3D microfocal inspection for semicon, advanced packaging and science and research.
- Designed for the semiconductor industry
- Non-destructive technology for three-dimensional insights into solder bumps within minutes
- Repeatable results through reliable and accurate technology, designed to support a stable inspection routine
- Efficient software-assisted review including automated void analysis with Void Insights
- Dose Manager for the protection of X-ray sensitive components
- Sample size 435 mm (17´´)
- Resolution < 1 um
| Category | Semicon X-RAY inspection |
|---|---|
| Our solution | Semicon testing and inspection |
| Supplier | Comet YXLON |
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