FEINMETALL ViProbe®
Adaptable to an enormous range of applications, the ViProbe® has been a proven buckling beam technology for more than 25 years, valued for its superior contacting quality and unique ease of repair.
Suitable for contacting:
- Pads, solder balls
- Gold, palladium, copper, diverse
| Category | Semiconductor testing products |
|---|---|
| Our solution | Semicon testing and inspection |
| Supplier | Feinmetall |
Specifications of the ViProbe® at a glance:
| Min pitch of the DUT | Down to 56 μm |
| Diameter of the contact element | Down to 1.6 mil |
| Max active area | Up to 80 mm x 80 mm |
| Capable temperature range | From -55°C to 180°C |
| Current carrying capability at RT | Up to 800 mA |
| Contact force at rec. OD | From 2.6 cN to 10.8 cN |
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